FPC外形切割、連接點切割 邊緣無碳化，無毛邊，切割效率高，切割精度高
陶瓷鍍銅、鍍鎳
線路直接成型
Ceramic – laser scribe and break
陶瓷鍍銅、鍍鎳
線路直接成型
Ceramic – laser scribe and break
Thin Film scribing
size: 4” × 4”
Thickness: 380 um
Chip size: 2000 um × 1000 um
size: 4” × 4”
Thickness: 380 um
Chip size: 400 um × 250um
size: 4” × 4”
Thickness: 381um
¢in: 100 ~ 80 um
¢out: 70~50um
size: 6” wafer
Chip size: 1310um × 1110um
Laser depth: ~140um
reak
Ceramic AlN3 via Drilling
Ceramic AlN3 via Drilling
8 inches Glass Drill
（2 mm diameter，1600 holes, 1.2 mm thickness）
Glass -D Bar Code
Marking/355nm
Glass 2-D Bar Code Marking by 532 nm
Diamond Cutting by 355 nm
Saphhire UV Laser Dot Marking - 0.8mm Text High
GaN Laser Marking
Diamond Sawing Results
Diamond Sawing Results
Wafer softmarking
Si drilling
Silicone Wafer Drilling
Silicone Wafer Drilling
Silicone Wafer Drilling
Cu-FR4-Cu Driling
Molybdenum 100um exit
